TOYALNITE™
TOYALNITE™ is a high purity aluminium nitride (AlN) powder with excellent thermal conductivity and insulating properties.
For sintering, filler and beyond …
Characteristics
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Very high purity AlN => Provides high thermal conductivity after sintering.
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Particle size distribution adjustment => Reduces shrinkage of molded part and increases strength of sintered part.
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Consistent quality management => Achieves stable quality.
Application examples
Electronic materials : substrate for power semiconductor device, substrate for LED, semiconductor manufacturing equipment, thermal conductive filler for TIM.
1. For filler (TFZ series)
Features
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High thermal conductivity.
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Good insulation performance.
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Waterproof treatment to eliminate hydrolysis.
Standard grades:
GRADE | D50 (µm) | SSA* (m²/g) | Oxygen (wt%) |
---|---|---|---|
TFZ-N01P | 1.2 | 2.8 | 0.9 |
TFZ-N05P | 5 | 1.1 | 0.9 |
TFZ-N10P | 10 | 1 | 0.9 |
TFZ-N15P | 15 | 0.9 | 0.3 |
*SSA : specific surface area
**All values are typical and are indicated for reference only
Waterproof grades:
GRADE | D50 (µm) | SSA* (m²/g) | Oxygen (wt%) |
---|---|---|---|
TFZ-A02P | 1.5 | 3 | 1.5 |
TFZ-A05P | 5 | 1.5 | 1 |
TFZ-A10P | 10 | 1.2 | 1 |
TFZ-A15P | 15 | 0.9 | 0.8 |
*SSA : specific surface area
**All values are typical and are indicated for reference only
Semi-spherical grades:
GRADE | D50 (µm) | SSA* (m²/g) | Oxygen (wt%) |
---|---|---|---|
TFZ-S05P | 5 | 0.5 | 0.2 |
TFZ-S20P | 20 | 0.2 | 0.1 |
TFZ-S30P | 30 | 0.2 | 0.1 |
TFZ-S60X | 55 | 0.15 | 0.1 |
*SSA : specific surface area
**All values are typical and are indicated for reference only
2. For sintering
Features
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High thermal conductivity due to high purity.
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High strength of sintered body achieved by controlled particle size distribution.
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High insulation properties. Coefficient of thermal expansion close to Si-chip.
GRADE | TYPE | D50 (µm) | SSA* (m²/g) | O (wt%) | Fe (ppm) | Si (ppm) | Ca (ppm) | Thermal Conductivity (W/m K) |
---|---|---|---|---|---|---|---|---|
JC | Standard | 1.2 | 2.8 | 0.9 | 15 | 30 | 5 | 175 |
JD | For low-temperature sintering | 1.2 | 2.8 | 0.9 | 15 | 30 | 200 | 175 |
JM | For sheet casting | 2.5 | 2.4 | 0.7 | 15 | 30 | 5 | 175 |
MF | Sub-standard | 2.5 | 3.8 | 1.0 | 15 | 30 | 5 | 175 |
*SSA : specific surface area
**All values are typical and are indicated for reference only
Granulated « Ready-to-press (RTP) » products available for press molding:
Granulated Grade | Raw Powder | D50 (µm) | Y2O3 (wt%) |
---|---|---|---|
JCGA | JC | 80 | 5 |
JDGA | JD | 80 | 5 |
MFGA | MF | 80 | 5 |
*All values are typical and are indicated for reference only