CONDUCTIVE MATERIALS : TECFILLER®
Toyal Group have the capability to plate a uniform layer of metal such as gold and silver on to particles of metal, inorganic or organic core.
Silver plated particles can achieve high electrical conductivity and cost savings vs pure silver.
Possibility to evenly plate on each individual primary particle.
Excellent electrical conductivity, resistance to oxidation, resistance to moisture and characteristics for ink preparation.
A wide range of particle sizes can be used.
Base material particle diameter : sub-micron to several mm.
Plating is possible on metals, ceramics and organic matter.
Plating film variations : Au, Ag, Ni, Cu, Sn, etc.
It is possible to control the particle morphology with consideration of electrical conductivity.
Filler for electromagnetic shielding.
Filler for electrically conductive ink, electrically conductive adhesive, etc.
We can respond to different needs based on combinations of materials, particle morphology and diameter. Please contact us for details.